Details

Title

Analysis Of Factors Affecting Gravity-Induced Deflection For Large And Thin Wafers In Flatness Measurement Using Three-Point-Support Method

Journal title

Metrology and Measurement Systems

Yearbook

2015

Volume

vol. 22

Numer

No 4

Authors

Keywords

flatness measurement ; large and thin silicon wafer ; GID ; three-point-support method ; initial stress

Divisions of PAS

Nauki Techniczne

Coverage

531-546

Publisher

Polish Academy of Sciences Committee on Metrology and Scientific Instrumentation

Date

2015[2015.01.01 AD - 2015.12.31 AD]

Type

Artykuły / Articles

Identifier

ISSN 0860-8229
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