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Abstract

Modern infrared cameras are constructed with two main types of infrared detectors: photon detectors and thermal detectors. Because of economic reasons, vast numbers of modern thermal cameras are constructed with the use of infrared microbolometric detectors which belong to the group of thermal detectors. Thermal detectors detect incident infrared radiation by measuring changes of temperature on the surface of a special micro-bridge structure. Thermal detectors, like microbolometric detectors on one hand should be sensitive to changing temperature to accurately measure incoming infrared radiation from the observed scene, on the other hand there are many other phenomena that change the temperature of the detector and influence the overall response of the detector. In order to construct an accurate infrared camera, there is a need to evaluate these phenomena and quantify their influence. In the article the phenomenon of self heating due to the operation of the readout circuit is analyzed on an UL 03 19 1 detector. The theoretical analysis is compared with the results of conducted measurements. Measurements with a type SC7900VL thermographic camera were performed to measure the thermodynamic behavior of the UL 03 19 1 detector array.
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