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Number of results: 34
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Abstract

The techniques of micro and nano structurization of surfaces of various materials are utilized in electronics and medicine. Such procedure as wet and dry etching allows to fabricate protruded or recessed micro and nanostructures on the surface. In the paper some examples of utilization of a surface structurization, known from literature, are described. Some structurization methods and experimental results for fabrication of the arrays of sharp microtips are presented. Wet and/or dry etching, and thermal oxidation process were used to form the arrays of sharp gated and non-gated, protruded or recessed silicon microtips on silicon wafer. For the first time, the arrays of silicon carbide (SiC) microtips on glass wafer have been produced by use of the transfer mold technique. Arrays of sharp microtips are used as field electron emission cathodes for vacuum microelectronics devices. Some electron emission measurements for these cathodes have been carried out. New application of silicon microtips array in biochemistry has been tested with satisfactory results.
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Abstract

The combined effect of sulfur (S) and acid soluble aluminum (Als) content on precipitates and microstructures in grainoriented silicon steel were investigated. The results show that there are dominant AlN and a little amount of MnS-AlN composite in annealed hot-rolled band, and the amount of precipitates increases distinctly with increasing Als content, while S content plays a negligible role. The inhibitors that precipitate during hot band annealing can restrain the grain growth during hot band annealing and primary annealing, and the smaller grains of annealed hot-rolled band can contribute to the formation of {111} <112> texture during primary annealing. Lower S content is conducive to the formation of {111} <112> texture during primary annealing by promoting the formation of Goss texture during hot rolling.
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Abstract

The ethylene vinyl acetate (EVA) is widely used for solar modules encapsulation. During lamination process EVA melts and chemical bonds between polymer chains are created. Its number is tightly related to cross-linking degree and it is consider as a major quality reference for module encapsulation. The lamination can be described as a process with two stages: melting and curing where the typical temperature for curing is in the range from 145 to 175°C. In the present study, for the first time, comparison of three commercial available EVA foils with low curing temperature EVA (EVA LOW). For this reason, the temperature of following lamination processes was set from a range from 115 to 175°C. The behavior of cured EVA films under investigation EVA was determined with two approaches: with extraction and with optical methods. The results indicate the applicability of these methods for the EVA cross-linking characterization. Finally, the extraordinary behavior of EVA LOW foil was noticed.
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Abstract

The research focused on the production of prototype castings, which is mapped out starting from the drawing documentation up to theproduction of the casting itself. The FDM method was applied for the production of the 3D pattern. Its main objective was to find out whatdimensional changes happened during individual production stages, starting from the 3D pattern printing through a silicon mouldproduction, wax patterns casting, making shells, melting out wax from shells and drying, up to the production of the final casting itself. Five measurements of determined dimensions were made during the production, which were processed and evaluated mathematically. A determination of shrinkage and a proposal of measures to maintain the dimensional stability of the final casting so as to meet requirements specified by a customer were the results.
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Abstract

The cooling rate is one of the main tools available to the process engineer by means of which it is possible to influence the crystallisation process. Imposing a desired microstructure on a casting as early as in the casting solidification phase widens significantly the scope of technological options at disposal in the process of aluminium-silicon alloy parts design and application. By changing the cooling rate it is possible to influence the course of the crystallisation process and thus also the material properties of individual microstructure components. In the study reported in this paper it has been found that the increase of cooling rate within the range of solidification temperatures of a complex aluminium-silicon alloy resulted in a decrease of values of the instrumented indentation hardness (HIT) and the instrumented indentation elastic modulus (EIT) characterising the intermetallic phase occurring in the form of polygons, rich in aluminium, iron, silicon, manganese, and chromium, containing also copper, nickel, and vanadium. Increased cooling rate resulted in supersaturation of the matrix with alloying elements.
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Abstract

The paper presents the issue of synthetic cast iron production in the electric induction furnace exclusively on the steel scrap base. Silicon carbide and synthetic graphite were used as carburizers. The carburizers were introduced with solid charge or added on the liquid metal surface. The chemical analysis of the produced cast iron, the carburization efficiency and microstructure features were presented in the paper. It was stated that ferrosilicon can be replaced by silicon carbide during the synthetic cast iron melting process. However, due to its chemical composition (30% C and 70% Si) which causes significant silicon content in iron increase, the carbon deficit can be partly compensated by the carburizer introduction. Moreover it was shown that the best carbon and silicon assimilation rate is obtained where the silicon carbide is being introduced together with solid charge. When it is thrown onto liquid alloy surface the efficiency of the process is almost two times less and the melting process lasts dozen minutes long. The microstructure of the cast iron produced with the silicon carbide shows more bulky graphite flakes than inside the microstructure of cast iron produced on the pig iron base.
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Abstract

Mg-0.5Si-xSn (x=0.95, 2.9, 5.02wt.%) alloys were cast and extruded at 593K (320 o C) with an extrusion ratio of 25. The microstructure and mechanical properties of as-cast and extruded test alloys were investigated by OM, SEM, XRD and tensile tests. The experimental results indicate that the microstructure of the Mg-0.5Si-xSn alloys consists of primary α-Mg dendrites and an interdendritic eutectic containing α-Mg, Mg2Si and Mg2Sn. There is no coarse primary Mg2Si phase in the test alloys due to low Si content. With the increase in the Sn content, the Mg2Si phase was refined. The shape of Mg2Si phase was changed from branch to short bar, and the size of them were reduced. The ultimate tensile strength and yield strength of Mg-0.52Si-2.9Sn alloy at the temperature of 473K (200 o C) reach 133MPa and 112MPa respectively. Refined eutectic Mg2Si phase and dispersed Mg2Sn phase with good elevated temperature stability are beneficial to improve the elevated temperature performance of the alloys. However, with the excess addition of Sn, large block-like Mg2Sn appears around the grain boundary leading to lower mechanical properties.
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Abstract

This paper describes the possibility of using very short periods of solution annealing in the heat treatment of unmodified hypoeutectic silumin alloy AlSi7Mg0,3 casted by method of casting with crystallization under pressure with forced convection (direct squeeze casting process). Castings prepared at different casting parameters were subjected to special heat treatment called SST (Silicon Spheroidization Treatment), which were originally used only for the modified silumin alloys to spheroidization of eutectic silicon. Temperature holding time in solution annealing of T6 heat treatment is limited in the SST process to only a few minutes. It was studied the effect of casting parameters and periods of solution annealing on ultimate strength, yield strength, and especially ductility that in the unmodified silumin alloy castings is relatively low.
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Abstract

This paper presents maps of spatial distributions of the short circuit current Isc(x,y) and the open circuit voltage Uoc(x,y) of the investigated low cost solar cells. Visible differences in values of these parameters were explained by differences in the serial and shunt resistances determined for different points of solar cells from measurements of I–V characteristics. The spectral dependence of the photo voltage of solar cell is also shown, discussed and interpreted in the model of amorphous and crystal silicon.
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